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Xu Ting, Wang Zi-Shuai, Li Xuan-Hua, Sha Wei E. I..Loss mechanism analyses of perovskite solar cells with equivalent circuit model. Acta Physica Sinica, 2021, 70(9): 098801.doi:10.7498/aps.70.20201975 |
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Cheng Zhe.Thermal science and engineering in third-generation semiconductor materials and devices. Acta Physica Sinica, 2021, 70(23): 236502.doi:10.7498/aps.70.20211662 |
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Liu Dan, Hu Sen.Two-dimensional silicon annular photonic crystals for realizing polarization-independent unidirectional transmission. Acta Physica Sinica, 2019, 68(2): 024206.doi:10.7498/aps.68.20181397 |
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Zhang Ning, Xu Kai-Kai, Chen Yan-Xu, Zhu Kun-Feng, Zhao Jian-Ming, Yu Qi.Application prospect of metal-oxide-semiconductor silicon light emitting devices in integrated circuits. Acta Physica Sinica, 2019, 68(16): 167803.doi:10.7498/aps.68.20191004 |
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Lou Guo-Feng, Yu Xin-Jie, Lu Shi-Hua.Equivalent circuit model for plate-type magnetoelectric laminate composite considering an interface coupling factor. Acta Physica Sinica, 2018, 67(2): 027501.doi:10.7498/aps.67.20172080 |
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Xiao Ting-Hui, Yu Yang, Li Zhi-Yuan.Graphene-silicon hybrid photonic integrated circuits. Acta Physica Sinica, 2017, 66(21): 217802.doi:10.7498/aps.66.217802 |
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Dong Gang, Liu Dang, Shi Tao, Yang Yin-Tang.Effects of thermal stress induced by mulitiple through silicon vias on mobility and keep out zone. Acta Physica Sinica, 2015, 64(17): 176601.doi:10.7498/aps.64.176601 |
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Dong Gang, Wu Wen-Shan, Yang Yin-Tang.Stack-through silicon via dynamic power consumption optimization in three-dimensional integrated circuit. Acta Physica Sinica, 2015, 64(2): 026601.doi:10.7498/aps.64.026601 |
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Hu Feng-Wei, Bao Bo-Cheng, Wu Hua-Gan, Wang Chun-Li.Equivalent circuit analysis model of charge-controlled memristor and its circuit characteristics. Acta Physica Sinica, 2013, 62(21): 218401.doi:10.7498/aps.62.218401 |
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Ju Sheng-Hong, Liang Xin-Gang.Thermal rectification and phonon scattering in silicon nanofilm with triangle hole. Acta Physica Sinica, 2013, 62(2): 026101.doi:10.7498/aps.62.026101 |
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Liang Yan, Yu Dong-Sheng, Chen Hao.A novel meminductor emulator based on analog circuits. Acta Physica Sinica, 2013, 62(15): 158501.doi:10.7498/aps.62.158501 |
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Bai Chun-Jiang, Li Jian-Qing, Hu Yu-Lu, Yang Zhong-Hai, Li Bin.Calculation of beam-wave interaction of coupled-cavity TWT using equivalent circuit model. Acta Physica Sinica, 2012, 61(17): 178401.doi:10.7498/aps.61.178401 |
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Peng Kai, Liu Da-Gang.Numerical simulation and study of three-dimensional thermal field emission. Acta Physica Sinica, 2012, 61(12): 121301.doi:10.7498/aps.61.121301 |
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Qian Li-Bo, Zhu Zhang-Ming, Yang Yin-Tang.Through-silicon-via-aware interconnect prediction model for 3D integrated circuirt. Acta Physica Sinica, 2012, 61(6): 068001.doi:10.7498/aps.61.068001 |
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Yang Wei-Qiang, Hou Jing, Song Rui, Liu Ze-Jin.Theoretical analysis of two-stage pumping technology for high power fiber lasers. Acta Physica Sinica, 2011, 60(8): 084210.doi:10.7498/aps.60.084210 |
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Yan Xiong-Wei, Yu Hai-Wu, Zheng Jian-Gang, Li Ming-Zhong, Jiang Xin-Ying, Duan Wen-Tao, Cao Ding-Xiang, Wang Ming-Zhe, Shang Xiao-Tong, Zhang Yong-Liang.Thermal-management of grad-doping Yb ∶YAG repetitive-rate laser. Acta Physica Sinica, 2011, 60(4): 047801.doi:10.7498/aps.60.047801 |
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Zhang Jin-Song, Wu Yi-Ping, Wang Yong-Guo, Tao Yuan.Thermomigration in micro interconnects in integrated circuits. Acta Physica Sinica, 2010, 59(6): 4395-4402.doi:10.7498/aps.59.4395 |
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Zhu Zhang-Ming, Hao Bao-Tian, Qian Li-Bo, Zhong Bo, Yang Yin-Tang.A compact interconnect temperature distribution model considering the via effect and the heat fringing effect. Acta Physica Sinica, 2009, 58(10): 7130-7135.doi:10.7498/aps.58.7130 |
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Hu Hui-Yong, Zhang He-Ming, Lü Yi, Dai Xian-Ying, Hou Hui, Ou Jian-Feng, Wang Wei, Wang Xi-Yuan.SiGe HBT large signal equivalent circuit model. Acta Physica Sinica, 2006, 55(1): 403-408.doi:10.7498/aps.55.403 |
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Zong Zhao-Xiang, Du Lei, Zhuang Yi-Qi, He Liang, Wu Yong.Modeling of resistance changes based on the free volume in VLSI interconnection electromigration. Acta Physica Sinica, 2005, 54(12): 5872-5878.doi:10.7498/aps.54.5872 |
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