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Zhao Lin-Yang, He Kan, Zhang Yan-Fang.The persistency of sharing tripartite nonlocality with noises. Acta Physica Sinica, 2024, 0(0): .doi:10.7498/aps.73.20241150 |
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Liu Hong-Mei, Yang Chun-Hua, Liu Xin, Zhang Jian-Qi, Shi Yun-Long.Noise characterization of quantum dot infrared photodetectors. Acta Physica Sinica, 2013, 62(21): 218501.doi:10.7498/aps.62.218501 |
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Tu Li-Lan, Liu Hong-Fang, Yu Le.Local adaptive H∞ consistency of delayed complex networks with noise. Acta Physica Sinica, 2013, 62(14): 140506.doi:10.7498/aps.62.140506 |
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Yao Tian-Liang, Liu Hai-Feng, Xu Jian-Liang, Li Wei-Feng.Noise-level estimation of noisy chaotic time series based on the invariant of the largest Lyapunov exponent. Acta Physica Sinica, 2012, 61(6): 060503.doi:10.7498/aps.61.060503 |
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Wang Can-Jun, Li Jiang-Cheng, Mei Dong-Cheng.Effect of noises on the stability of a metapopulation. Acta Physica Sinica, 2012, 61(12): 120506.doi:10.7498/aps.61.120506 |
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Wu Zhen-Yu, Dong Si-Wan, Liu Yi, Chai Chang-Chun, Yang Yin-Tang.Resistometric study on electromigration failure in copper interconnects. Acta Physica Sinica, 2012, 61(24): 248501.doi:10.7498/aps.61.248501 |
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Wu Zhen-Yu, Yang Yin-Tang, Chai Chang-Chun, Liu Li, Peng Jie, Wei Jing-Tian.A microstructure-based study on electromigration in Cu interconnects. Acta Physica Sinica, 2012, 61(1): 018501.doi:10.7498/aps.61.018501 |
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Huang Ming-Liang, Chen Lei-Da, Zhou Shao-Ming, Zhao Ning.Effect of electromigration on interfacial reaction in Ni/Sn3.0Ag0.5Cu/Au/Pd/Ni-P flip chip solder joints. Acta Physica Sinica, 2012, 61(19): 198104.doi:10.7498/aps.61.198104 |
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Zhang Chun-Min, Huang Wei-Jian, Zhao Bao-Chang.Analysis and evaluation on the noise of novel polarization interference imaging spectrometer. Acta Physica Sinica, 2010, 59(8): 5479-5486.doi:10.7498/aps.59.5479 |
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Yang Yong-Feng, Wu Ya-Feng, Ren Xing-Min, Qiu Yan.The effect of random noise for empirical mode decomposition of nonlinear signals. Acta Physica Sinica, 2010, 59(6): 3778-3784.doi:10.7498/aps.59.3778 |
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Wang Hui-Qiao, Yu Lian-Chun, Chen Yong.Effects of channel noise on metabolic energy cost of action potentials. Acta Physica Sinica, 2009, 58(7): 5070-5074.doi:10.7498/aps.58.5070 |
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Lu Yu-Dong, He Xiao-Qi, En Yun-Fei, Wang Xin, Zhuang Zhi-Qiang.Electromigration in Sn3.0Ag0.5Cu flip chip solder joint. Acta Physica Sinica, 2009, 58(3): 1942-1947.doi:10.7498/aps.58.1942 |
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Li Wei-Hua, Zhuang Yi-Qi, Du Lei, Bao Jun-Lin.Non-Gaussianity of noise in n-type metal oxide semiconductor field effect transistor. Acta Physica Sinica, 2009, 58(10): 7183-7188.doi:10.7498/aps.58.7183 |
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He Liang, Du Lei, Zhuang Yi-Qi, Li Wei-Hua, Chen Jian-Ping.Multiscale entropy complexity analysis of metallic interconnection electromigration noise. Acta Physica Sinica, 2008, 57(10): 6545-6550.doi:10.7498/aps.57.6545 |
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Liu Ze-Zhuan, Yang Zhi-An.Influence of noise on self-trapping of Bose-Einstein condensates in double-well trap. Acta Physica Sinica, 2007, 56(3): 1245-1252.doi:10.7498/aps.56.1245 |
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Chen Chun-Xia, Du Lei, He Liang, Hu Jin, Huang Xiao-Jun, Wei Tao.Fractal character of noise in electromigration in metel interconnection. Acta Physica Sinica, 2007, 56(11): 6674-6679.doi:10.7498/aps.56.6674 |
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.Research on noise correlation dimension of metallic interconnection electromigration. Acta Physica Sinica, 2007, 56(12): 7176-7182.doi:10.7498/aps.56.7176 |
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Zhang Wen-Jie, Yi Wan-Bing, Wu Jin.Electromigration in Al interconnects and the challenges in ultra-deep submicron technology. Acta Physica Sinica, 2006, 55(10): 5424-5434.doi:10.7498/aps.55.5424 |
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Zong Zhao-Xiang, Du Lei, Zhuang Yi-Qi, He Liang, Wu Yong.Modeling of resistance changes based on the free volume in VLSI interconnection electromigration. Acta Physica Sinica, 2005, 54(12): 5872-5878.doi:10.7498/aps.54.5872 |
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Du Lei, Zhuang Yi-Qi, Xue Li-Jun.Ａｕｎｉｆｉｅｄｍｏｄｅｌｆｏｒ 1 ｆｎｏｉｓｅａｎｄ 1 ｆ2 ｎｏｉｓｅｄｕｅｔｏｅｌｅｃｔｒｏｍｉｇｒａｔｉｏｎｉｎｍｅｔａｌｆｉｌｍ. Acta Physica Sinica, 2002, 51(12): 2836-2841.doi:10.7498/aps.51.2836 |
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